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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9433075 B1

PDFFull Text
Date of Patent:
Aug. 30, 2016

Filed:

Aug. 09, 2013

Electric power semiconductor device

Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Junji Fujino, Chiyoda-ku, JP;

Yutaka Yoneda, Chiyoda-ku, JP;

Yoshitaka Onishi, Chiyoda-ku, JP;

Masafumi Sugawara, Chiyoda-ku, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo, JP;

Attorney:

Buchanan Ingersoll & Rooney PC

Primary Examiner:

Anthony Haughton

Assistant Examiner:

Razeem Gafur

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/473 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/492 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04034 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37012 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/4005 (2013.01); H01L 2224/4024 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/4118 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8346 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/84447 (2013.01); H01L 2224/84801 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1576 (2013.01); H01L 2924/15724 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16172 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

An electric power semiconductor device includes a heat transfer plate. A printed wire board is spaced a predetermined gap apart from the heat transfer plate. An opening portion is provided in the vicinity of an electrode strip formed on the outer side of the printed wire board. An electric power semiconductor element is disposed between the heat transfer plate and the printed wire board, and adhered to the heat transfer plate. A wiring member has one end bonded to a first bonding portion of a main power electrode of the electric power semiconductor element, and the other end is bonded to a second bonding portion. At least part of the second bonding portion is included in a space that extends from the main power electrode to the printed wire board, and the first bonding portion is included in a space that extends from the opening portion.

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