logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9431373 B1

PDFFull Text
Date of Patent:
Aug. 30, 2016

Filed:

Dec. 16, 2014

Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure

Applicants:

Stmicroelectronics SA, Montrouge, FR;

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Inventors:

Rachid Taibi, Marseilles, FR;

Cédrick Chappaz, Pontcharra, FR;

Lea Di Cioccio, Saint Ismier, FR;

Laurent-Luc Chapelon, Domene, FR;

Assignees:

STMICROELECTRONICS SA, Montrouge, FR;

STMICROELECTRONICS (CROLLES 2) SAS, Crolles, FR;

Attorney:

Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.

Primary Examiner:

Marc Armand

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 25/065 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 22/14 (2013.01); H01L 22/12 (2013.01); H01L 27/0688 (2013.01); H01L 2224/48463 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06596 (2013.01);
Abstract

A three-dimensional integrated structure may include two assembled integrated circuits respectively including two metallic lines, and at least two cavities passing through one of the integrated circuits and opening onto two locations respectively in electrical contact with the two metallic lines. The cavities may be sized to place a measuring apparatus at the bottom of the cavities, and in electrical contact with the two locations.

Find Patent Forward Citations

Taibi, Rachid. (2016). Method for estimating the diffusion length of metallic species within a three-dimensional integrated structure, and corresponding three-dimensional integrated structure (U.S. Patent No. 9431373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9431373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…