The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Jan. 09, 2015
Amkor Technology, Inc., Chandler, AZ (US);
Hyung Il Jeon, Gyeonggi-do, KR;
Byong Jin Kim, Gyeonggi-do, KR;
Gi Jeong Kim, Gyeonggi-do, KR;
Jae Min Bae, Seoul, KR;
Tae Ki Kim, Seoul, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
In one embodiment, a semiconductor device includes a single layer substrate having an insulation layer and conductive patterns on a first surface of the insulation layer. A semiconductor die is attached on a first surface of the single layer substrate and electrically connected to the conductive patterns. Conductive bumps are also on the first surface of the single layer substrate and electrically connected to the semiconductor die through the conductive patterns. An encapsulant overlaps at least portions of the first surface of the single layer substrate. The conductive bumps are at least partially exposed in the encapsulant.