The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Dec. 10, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jack O. Chu, Manhasset Hills, NY (US);

Szu Lin Cheng, Hsin-Chu, TW;

Isaac Lauer, Yorktown Heights, NY (US);

Kuen-Ting Shiu, White Plains, NY (US);

Jeng-Bang Yau, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/8234 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01); H01L 29/205 (2006.01); H01L 21/308 (2006.01); H01L 21/3065 (2006.01); H01L 21/283 (2006.01); H01L 21/3213 (2006.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823487 (2013.01); H01L 21/0262 (2013.01); H01L 21/02538 (2013.01); H01L 21/02636 (2013.01); H01L 21/283 (2013.01); H01L 21/308 (2013.01); H01L 21/3065 (2013.01); H01L 21/32133 (2013.01); H01L 21/762 (2013.01); H01L 21/823412 (2013.01); H01L 21/823431 (2013.01); H01L 21/823468 (2013.01); H01L 21/823481 (2013.01); H01L 27/0886 (2013.01); H01L 29/068 (2013.01); H01L 29/0649 (2013.01); H01L 29/0676 (2013.01); H01L 29/1054 (2013.01); H01L 29/205 (2013.01); H01L 29/6656 (2013.01); H01L 29/6681 (2013.01); H01L 29/66666 (2013.01); H01L 29/785 (2013.01); H01L 29/7827 (2013.01); H01L 29/7849 (2013.01);
Abstract

A semiconductor structure includes a plurality of semiconductor fins located on a semiconductor substrate, in which each of the semiconductor fins comprises a sequential stack of a buffered layer including a III-V semiconductor material and a channel layer including a III-V semiconductor material. The semiconductor structure further includes a gap filler material surrounding the semiconductor fins and including a plurality of trenches therein. The released portions of the channel layers of the semiconductor fins located in the trenches constitute nanowire channels of the semiconductor structure, and opposing end portions of the channel layers of the semiconductor fins located outside of the trenches constitute a source region and a drain region of the semiconductor structure, respectively. In addition, the semiconductor structure further includes a plurality of gates structures located within the trenches that surround the nanowire channels in a gate all around configuration.


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