The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9431292 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 30, 2016

Filed:

Apr. 29, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Griselda Bonilla, Fishkill, NY (US);

Samuel S. S. Choi, Beacon, NY (US);

Ronald G. Filippi, Wappingers Falls, NY (US);

Elbert E. Huang, Carmel, NY (US);

Naftali E. Lustig, Croton on Hudson, NY (US);

Andrew H. Simon, Fishkill, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76808 (2013.01); H01L 21/76835 (2013.01); H01L 21/76846 (2013.01); H01L 21/76873 (2013.01); H01L 21/76879 (2013.01); H01L 23/53238 (2013.01); H01L 23/53295 (2013.01);
Abstract

After forming at least one opening in a material stack comprising a sacrificial metal template layer overlying a first dielectric material layer, a sacrificial material portion is deposited in the at least one opening as a place holder for an interconnect structure later formed. Next, the sacrificial metal template layer is removed and a second dielectric material layer is formed to fill voids that were previously occupied by the sacrificial metal template layer. After removing the sacrificial material portion from the at least one opening, an interconnect structure is formed within the at least one opening.


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