The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Nov. 26, 2014
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Sameer P Pendharkar, Allen, TX (US);

Binghua Hu, Plano, TX (US);

Abbas Ali, Plano, TX (US);

Henry Litzmann Edwards, Garland, TX (US);

John P. Erdeljac, Plano, TX (US);

Britton Robbins, McKinney, TX (US);

Jarvis Benjamin Jacobs, Murphy, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/761 (2006.01); H01L 29/06 (2006.01); H01L 21/263 (2006.01);
U.S. Cl.
CPC ...
H01L 21/761 (2013.01); H01L 21/263 (2013.01); H01L 29/0646 (2013.01);
Abstract

A semiconductor device with a buried layer has a deep trench structure abutting the buried layer and a self-aligned sinker along sidewalls of the deep trench structure. The semiconductor device may be formed by forming a portion of a deep trench down to the buried layer, and implanting dopants into a substrate of the semiconductor device along sidewalls of the deep trench, and subsequently forming a remainder of the deep trench extending below the buried layer. Alternatively, the semiconductor device may be formed by forming the deep trench to extend below the buried layer, and subsequently implanting dopants into the substrate of the semiconductor device along sidewalls of the deep trench.


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