The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Jun. 12, 2015
Applicant:
SK Hynix Inc., Gyeonggi-do, KR;
Inventors:
Su-Bum Shin, Gyeonggi-do, KR;
Hae-Jung Lee, Gyeonggi-do, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 21/4763 (2006.01); H01L 21/28 (2006.01); H01L 29/40 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28132 (2013.01); H01L 21/0206 (2013.01); H01L 21/28088 (2013.01); H01L 21/31116 (2013.01); H01L 29/401 (2013.01); H01L 29/4966 (2013.01); H01L 21/31122 (2013.01);
Abstract
A method for etching a gate includes forming a high-k material layer over a substrate; forming an overlying layer over the high-k material layer; performing a first etching process for etching the overlying layer to form an overlying layer pattern; forming a spacer on a sidewall of the overlying layer pattern; and performing a second etching process using plasma including a etch gas and an additive gas, to etch the high-k material layer, wherein an amount of the additive gas is substantially the same as the main etch gas to increase an etch selectivity with respect to the substrate.