The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Feb. 19, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hua-Chou Tseng, Hsinchu, TW;

Chien-Chih Ho, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/266 (2006.01); H01L 29/10 (2006.01); H01L 21/761 (2006.01); H01L 29/66 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 21/266 (2013.01); H01L 21/26513 (2013.01); H01L 21/761 (2013.01); H01L 29/1079 (2013.01); H01L 29/66568 (2013.01); H01L 29/66575 (2013.01); H01L 29/78 (2013.01);
Abstract

A method of forming a semiconductor device includes patterning a first mask over a substrate defining a first opening. The substrate includes a first dopant type. The method includes implanting ions having a second dopant type through the first opening to form a first deep well. The method includes patterning a second mask over the substrate defining a second opening. The method includes implanting ions having the second dopant type through the second opening to form a second deep well, wherein an energy for implanting ions to form the second deep well is lower than an energy for implanting ions to form the first deep well. The method includes implanting ions having the first dopant type into the substrate to form a first well, wherein the energy for implanting ions to form the second deep well is greater than an energy for implanting ions to form the first well.


Find Patent Forward Citations

Loading…