The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 2016

Filed:

Aug. 01, 2012
Applicants:

Theodoros E. Anemikos, Milton, VT (US);

Jeanne P. Bickford, Essex Junction, VT (US);

Douglas S. Dewey, Highgate, VT (US);

Ernest A. Viau, Jr., Colchester, VT (US);

Inventors:

Theodoros E. Anemikos, Milton, VT (US);

Jeanne P. Bickford, Essex Junction, VT (US);

Douglas S. Dewey, Highgate, VT (US);

Ernest A. Viau, Jr., Colchester, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); G01R 31/28 (2006.01); G05B 19/418 (2006.01); G01R 31/317 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2894 (2013.01); G01R 31/287 (2013.01); G01R 31/2855 (2013.01); G01R 31/2868 (2013.01); G01R 31/2879 (2013.01); G01R 31/31718 (2013.01); G05B 19/41875 (2013.01);
Abstract

Methods and systems optimize power usage in an integrated circuit design by sorting the integrated circuit devices after manufacture into relatively slow integrated circuit devices and relatively fast integrated circuit devices to classify the integrated circuit devices into different voltage bins. The methods and systems establish a bin-specific reliability testing processes for each of the voltage bins and test the integrated circuit devices using a tester. This allows the methods and systems to identify as defective ones of the integrated circuit devices that fail the bin-specific integrated circuit reliability testing processes of a corresponding voltage bin. The methods and systems remove the defective ones of the integrated circuit devices to allow only non-defective integrated circuit devices to remain and supply the non-defective integrated circuit devices to a customer.


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