The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Apr. 07, 2015
Applicant:

Monolith Semiconductor, Inc., Round Rock, TX (US);

Inventors:

Kevin Matocha, Round Rock, TX (US);

John Nowak, Bertram, TX (US);

Kiran Chatty, Round Rock, TX (US);

Sujit Banerjee, Round Rock, TX (US);

Assignee:

MONOLITH SEMICONDUCTOR INC., Round Rock, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 23/00 (2006.01); H01L 29/16 (2006.01); H01L 29/45 (2006.01); H01L 21/283 (2006.01); H01L 23/26 (2006.01); H01L 23/31 (2006.01); H01L 29/10 (2006.01); H01L 21/04 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 23/564 (2013.01); H01L 21/0445 (2013.01); H01L 21/0485 (2013.01); H01L 21/283 (2013.01); H01L 23/26 (2013.01); H01L 23/3192 (2013.01); H01L 24/05 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01); H01L 29/45 (2013.01); H01L 29/66068 (2013.01); H01L 29/7823 (2013.01); H01L 21/823475 (2013.01); H01L 29/0843 (2013.01); H01L 29/66893 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/051 (2013.01); H01L 2224/0517 (2013.01); H01L 2224/0519 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05172 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05567 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01);
Abstract

Semiconductor devices comprising a getter material are described. The getter material can be located in or over the active region of the device and/or in or over a termination region of the device. The getter material can be a conductive or an insulating material. The getter material can be present as a continuous or discontinuous film. The device can be a SiC semiconductor device such as a SiC vertical MOSFET. Methods of making the devices are also described. Semiconductor devices and methods of making the same comprising source ohmic contacts formed using a self-aligned process are also described. The source ohmic contacts can comprise titanium silicide and/or titanium silicide carbide and can act as a getter material.


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