The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2016

Filed:

Jun. 26, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Ming-Sung Kuo, Zhubei, TW;

Chiun-Chieh Su, Hsinchu, TW;

Chih-Shun Chu, Hsinchu, TW;

To-Yu Chen, Tu-Ku Town, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); H01L 21/66 (2006.01); G01N 21/33 (2006.01); G01N 21/47 (2006.01); G01N 21/55 (2014.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); H01L 22/12 (2013.01); G01N 21/33 (2013.01); G01N 21/4788 (2013.01); G01N 21/55 (2013.01);
Abstract

An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface.


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