The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Mar. 06, 2014
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Young Kwan Lee, Suwon-si, KR;
Myung Sam Kang, Suwon-si, KR;
Joo Hwan Jung, Suwon-si, KR;
Ju Hee Park, Suwon-si, KR;
Seung Yeop Kook, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/46 (2006.01); H01L 23/13 (2006.01); H05K 3/34 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4682 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/18161 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/10674 (2013.01); Y10T 29/49147 (2015.01);
Abstract
Disclosed herein are a coreless board for a semiconductor package and a method of manufacturing the same. The coreless board for the semiconductor package includes: a support; a build-up layer formed on the support; an external connection terminal formed on the build-up layer; and a solder resist layer formed on the build-up layer so as to expose the external connection terminal.