The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Aug. 13, 2013
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC CO., LTD., , TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H01L 23/498 (2006.01); H01L 33/62 (2010.01); H05K 1/02 (2006.01); H01L 33/48 (2010.01); H01L 23/15 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4061 (2013.01); H01L 23/49827 (2013.01); H01L 33/62 (2013.01); H05K 1/0293 (2013.01); H01L 23/15 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H05K 1/116 (2013.01); H05K 1/167 (2013.01); H05K 1/181 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/049 (2013.01);
Abstract
A current conducting element including a substrate, a through hole, an electrode layer and a conductor structure is provided. The through hole is disposed through the substrate and has a first opening. The electrode layer is disposed on the substrate. A portion of the first opening is exposed from the electrode layer. The conductor structure is disposed in the through hole and contacted with the electrode layer. The electrode layer and the conductor structure form a current conducting path.