The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Jul. 12, 2010
Applicants:

Ahmer Raza Syed, Chandler, AZ (US);

Bob Shih-wei Kuo, Chandler, AZ (US);

Louis B. Troche, Jr., Gilbert, AZ (US);

Inventors:

Ahmer Raza Syed, Chandler, AZ (US);

Bob Shih-Wei Kuo, Chandler, AZ (US);

Louis B. Troche, Jr., Gilbert, AZ (US);

Assignee:

Amkor Technology, Inc., Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 9/08 (2006.01); H04R 11/04 (2006.01);
U.S. Cl.
CPC ...
H04R 9/08 (2013.01); H04R 11/04 (2013.01);
Abstract

A top port MEMS microphone package includes a substrate having a back volume expanding aperture therein. A MEMS microphone electronic component is mounted to the substrate directly above the back volume expanding aperture such that an aperture of the MEMS microphone electronic component is in fluid communication with the back volume expanding aperture. A lid having a lid cavity is mounted to the substrate. The back volume expanding aperture couples the aperture of the MEMS microphone electronic component to the lid cavity. By coupling the lid cavity to the aperture with the back volume expanding aperture, the resulting back volume is essentially the size of the entire top port MEMS microphone package. In this manner, the noise to signal ratio is minimized thus maximizing the sensitivity of the top port MEMS microphone package as well as the range of applications.


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