The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Mar. 23, 2015
Xilinx, Inc., San Jose, CA (US);
Woon-Seong Kwon, Cupertino, CA (US);
Suresh Ramalingam, Fremont, CA (US);
XILINX, INC., San Jose, CA (US);
Abstract
In one example, a semiconductor assembly comprises a first IC die, a second IC die, and a bridge module. The first IC die includes, on a top side thereof, first interconnects of a plurality of interconnects and first inter-die contacts of a plurality of inter-die contacts. The second IC die includes, on a top side thereof, second interconnects of the plurality of interconnects and second inter-die contacts of the plurality of inter-die contracts. The bridge module is disposed between the first interconnects and the second interconnects and includes bridge interconnects on a top side thereof, the bridge interconnects mechanically and electrically coupled to the plurality of inter-die contacts, and layer(s) of conductive interconnect disposed on the top side thereof to route signals between the first IC and the second IC. A back side of the bridge module does not extend beyond a height of the plurality of interconnects.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile