The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Nov. 25, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Patrick Nardi, Scottsdale, AZ (US);
Kelly P. Lofgreen, Phoenix, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 21/00 (2006.01); H01L 23/367 (2006.01); G06F 1/20 (2006.01); H01L 23/495 (2006.01); F28F 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); G06F 1/20 (2013.01); H01L 23/49568 (2013.01); F28F 3/025 (2013.01); H01L 2224/18 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/16152 (2013.01);
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.