The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Feb. 06, 2013
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Ki Bum Sung, Seoul, KR;

Jo Young Lee, Seoul, KR;

Mhan Joong Kim, Seoul, KR;

Chang Geun Ahn, Seoul, KR;

Jung Hyun Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C 13/02 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); B05C 13/02 (2013.01); H01L 21/68735 (2013.01); H01L 21/68764 (2013.01); H01L 21/68771 (2013.01);
Abstract

Disclosed is a semiconductor manufacturing apparatus including at least one pocket on which a passive subject on which deposition will be executed is mounted, and a carrier body having an insertion space to which the at least one pocket is detachably attached. Therefore, the semiconductor manufacturing apparatus shortens process time and reduces process expenses. The semiconductor manufacturing apparatus allows respective pockets to have different structures according to the positions of the pockets on the wafer carrier, and thus achieves uniform growth of a material on the surfaces of wafers regardless of the positions of the pockets.

Published as:
CN103255393A; EP2629327A2; US2013213300A1; KR20130094601A; JP2013168650A; US9418885B2; EP2629327A3; JP6126405B2; CN103255393B; KR101928356B1; EP2629327B1;

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