The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Jun. 06, 2013
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventors:

Ki-Hyun Cho, Suwon-si, KR;

Hoon Kang, Suwon-si, KR;

Jae-Sung Kim, Suwon-si, KR;

Dong-Min Kim, Hwaseong-si, KR;

Seung-Ki Kim, Hwaseong-si, KR;

Eun Jeagal, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/40 (2006.01); G03F 7/038 (2006.01); G03F 7/016 (2006.01); G03F 7/022 (2006.01); G03F 7/039 (2006.01); G03F 7/09 (2006.01); G03F 7/16 (2006.01); G03F 7/30 (2006.01); G03F 7/36 (2006.01); G03F 7/38 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0048 (2013.01); G03F 7/0163 (2013.01); G03F 7/022 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/09 (2013.01); G03F 7/092 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/30 (2013.01); G03F 7/36 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01);
Abstract

A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer and a mixed solvent including a first solvent, a second solvent having a higher volatility than the first solvent, and a third solvent having a higher volatility than the second solvent. The coating layer is exposed to light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.


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