The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Jun. 17, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Byung Ju Choi, Daejeon, KR;

Woo Jae Jeong, Daejeon, KR;

Bo Yun Choi, Daejeon, KR;

Kwang Joo Lee, Daejeon, KR;

Min Su Jeong, Daejeon, KR;

Se Jin Ku, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/027 (2006.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); C09D 133/06 (2006.01);
U.S. Cl.
CPC ...
C08K 3/04 (2013.01); C08K 3/08 (2013.01); C09D 133/068 (2013.01); G03F 7/027 (2013.01); C08L 2312/06 (2013.01);
Abstract

The present invention relates to a photocurable and thermosetting resin composition, including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, and an organic solvent, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist.


Find Patent Forward Citations

Choi, Byung. (2016). Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist (U.S. Patent No. 9416243). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9416243

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…