The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2016

Filed:

Aug. 28, 2013
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Sho Tatsuoka, Naka-gun, JP;

Naoyuki Iwasaki, Naka-gun, JP;

Kenji Yamaguchi, Naka-gun, JP;

Akira Osada, Moriya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 27/14 (2006.01); C23C 16/36 (2006.01); C23C 30/00 (2006.01); C23C 28/04 (2006.01); C23C 28/00 (2006.01); C23C 16/02 (2006.01); C23C 16/34 (2006.01);
U.S. Cl.
CPC ...
B23B 27/148 (2013.01); C23C 16/0272 (2013.01); C23C 16/34 (2013.01); C23C 16/36 (2013.01); C23C 28/042 (2013.01); C23C 28/044 (2013.01); C23C 28/42 (2013.01); C23C 30/005 (2013.01); B23B 2200/08 (2013.01); B23B 2200/16 (2013.01); B23B 2222/28 (2013.01); B23B 2222/61 (2013.01); B23B 2224/00 (2013.01); B23B 2224/32 (2013.01); B23B 2226/125 (2013.01); B23B 2228/04 (2013.01); B23B 2228/44 (2013.01); B23B 2228/56 (2013.01); Y10T 428/31678 (2015.04);
Abstract

A coated tool with a hard coating layer, which has an excellent hardness and heat insulating effect; and exhibits an excellent chipping resistance and an excellent fracturing resistance for a long-term usage, is provided. The hard coating layer included in the coated tool has a chemically vapor deposited alternate laminated structure, which is made of: a region A layer and a region B layer, each of which is expressed by the composition formula of (TiAl)(CN); and has the average total layer thickness of 1-10 μm. In the region A layer, relationships, 0.70≦x≦0.80 and 0.0005≦y≦0.005, are satisfied; the average grain width W is 0.1 μm or less; and the average grain length L is 0.1 μm or less. In the region B layer, relationships, 0.85≦x≦0.95 and 0.0005≦y≦0.005, are satisfied; the average grain width W is 0.1-2.0 μm; and the average grain length L is 0.5-5.0 μm.


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