The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Dec. 29, 2014
Applicant:

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Jin-Han Wu, Kunshan, CN;

Chih-Ching Hsu, New Taipei, TW;

Jun-Hua Hu, Kun Shan, CN;

Huan Chen, Kunshan, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 24/64 (2011.01); H01R 13/6587 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 24/64 (2013.01); H01R 13/6587 (2013.01); H01R 2107/00 (2013.01);
Abstract

A modular jack has an insulative housing, two adjacent internal modules, and a middle shield disposed between the adjacent internal modules. The insulative housing has a front wall and a plurality of openings therein configured as pairs of first and second aligned openings, and a receptacle located behind the openings. Each opening is configured to receive a plug connector therein in a front-to-back direction. The middle shield extends towards a front wall of the insulative to define two module receiving cavities each receiving one internal module. The middle shield includes a conductive plate and an insulative sheet affixed thereto. The insulative sheet faces to the internal modules for insulation between the internal modules and the conductive plate. The insulative sheet is very thin that it occupies little space of the receptacle, thereby reducing a size of the modular jack.


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