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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9412921 B1

PDFFull Text
Date of Patent:
Aug. 09, 2016

Filed:

Sep. 04, 2013

Module structure

Applicants:

Industrial Technology Research Institute, Hsinchu, TW;

Kuo Hsin Technology Co., Ltd., Kaohsiung, TW;

Inventors:

Wen-Hsien Wang, Jiali Township, TW;

Min-Tsung Kuan, Qingshui Township, TW;

Tzong-Ming Lee, Hsinchu, TW;

Wen-Hsien Chou, Lunbei Township, TW;

Fu-Ming Lin, Zhudong Township, TW;

Wen-Kuei Lee, Puyan Township, TW;

Chin Zeng Yeh, Kaohsiung, TW;

Ming-Hung Chen, Kaohsiung, TW;

Chung-Teng Huang, Taichung, TW;

Hsueh Jen Fu, Kaohsiung, TW;

Assignee:

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Ling Choi

Assistant Examiner:

Catherine S Branch

Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 31/0203 (2014.01); H01L 51/52 (2006.01); B32B 27/32 (2006.01); H01L 31/048 (2014.01); H01L 31/049 (2014.01); C09D 123/02 (2006.01); C09D 123/08 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); B32B 27/08 (2013.01); B32B 27/302 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); C09D 123/02 (2013.01); C09D 123/0853 (2013.01); H01L 31/049 (2014.12); H01L 31/0481 (2013.01); H01L 51/524 (2013.01); H01L 51/5253 (2013.01); B32B 2250/24 (2013.01); B32B 2307/558 (2013.01); B32B 2457/00 (2013.01); B32B 2457/202 (2013.01); C08L 2203/204 (2013.01); Y02E 10/50 (2013.01);
Abstract

Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.

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