The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Sep. 30, 2014
Applicant:

Sandisk Technologies Inc., Plano, TX (US);

Inventors:

Keisuke Izumi, Yokkaichi, JP;

Michiaki Sano, Ichinomiya, JP;

Hiroshi Sasaki, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); H01L 27/115 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1157 (2013.01); H01L 21/7688 (2013.01); H01L 21/76805 (2013.01); H01L 27/11582 (2013.01);
Abstract

A method of making multi-level contacts includes providing an in-process multilevel device having a device region and a contact region including a stack of a plurality of alternating sacrificial layers and insulator layers located over a major surface of a substrate. A contact mask with at least one contact mask opening and at least one first terrace mask opening is provided over the stack, where the at least one first terrace mask opening is larger than the at least one contact mask opening. At least one first contact opening and at least one first terrace opening are simultaneously formed extending substantially perpendicular to the major surface of the substrate through the stack to a first sacrificial layer by etching a portion of the stack through the at least one contact mask opening and the at least one first terrace mask opening. A first electrically conductive via contact is deposited in the at least one first contact opening.


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