The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Feb. 17, 2015
Applicant:
Powertech Technology Inc., Hsinchu County, TW;
Inventors:
Chien-Wen Huang, Hsinchu County, TW;
Ming-Hung Chang, Hsinchu County, TW;
Assignee:
Powertech Technology Inc., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 2924/181 (2013.01);
Abstract
A chip package structure including a main substrate, a carrier substrate, at least a chip, a molding compound, a shielding layer and a plurality of connection structures between the main substrate and the carrier substrate. The shielding layer covers the top surface and the sidewalls of the molding compound and a portion of the carrier substrate. The shielding layer is electrically grounded through the connection structures.
Huang, Chien-Wen. (2016). Chip package structure having a shielded molding compound (U.S. Patent No. 9412703). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9412703
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile