The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Jan. 13, 2015
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Yu-Ting Cheng, New Taipei, TW;
Yu-Min Fu, Taoyuan, TW;
Assignee:
WINBOND ELECTRONICS CORP., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/08238 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1511 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/351 (2013.01);
Abstract
A flexible microsystem structure is provided. The flexible microsystem structure includes a flexible substrate; and a chip disposed over the flexible substrate, wherein the chip is bonded to the flexible substrate by a plurality of bonding elements disposed over the flexible substrate; wherein the flexible substrate has at least one trench disposed under the chip and disposed along at least one side of at least one of the bonding elements.