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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9412636 B1

PDFFull Text
Date of Patent:
Aug. 09, 2016

Filed:

Apr. 09, 2015

Methods for processing substrates

Applicant:

Samsung Electronics Co., Ltd, Suwon-si, Gyeonggi-do, KR;

Inventors:

Chungsun Lee, Anyang-si, KR;

Jung-Seok Ahn, Seoul, KR;

Kwang-chul Choi, Suwon-si, KR;

Un-Byoung Kang, Hwaseong-si, KR;

Jung-Hwan Kim, Bucheon-si, KR;

Joonsik Sohn, Yongin-si, KR;

Jeon Il Lee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

George Fourson, III

Int. Cl.
CPC ...
H01L 21/58 (2006.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); B32B 37/24 (2006.01); B32B 37/26 (2006.01); B32B 38/04 (2006.01); B32B 38/10 (2006.01); B32B 38/16 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 37/1284 (2013.01); B32B 37/18 (2013.01); B32B 37/24 (2013.01); B32B 37/26 (2013.01); B32B 38/04 (2013.01); B32B 38/10 (2013.01); B32B 38/162 (2013.01); H01L 21/02057 (2013.01); H01L 21/02126 (2013.01); H01L 21/304 (2013.01); H01L 21/76898 (2013.01); H01L 24/03 (2013.01); H01L 24/14 (2013.01); B32B 2037/268 (2013.01); B32B 2315/08 (2013.01); B32B 2457/14 (2013.01); H01L 21/6836 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/13023 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); Y10S 438/977 (2013.01);
Abstract

A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.

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