The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2016

Filed:

Jul. 24, 2013
Applicant:

Cadence Design Systems, Inc., San Jose, CA (US);

Inventors:

John O'Donovan, San Jose, CA (US);

Jushan Xie, Pleasanton, CA (US);

Saibal Saha, Cupertino, CA (US);

Assignee:

CADENCE DESIGN SYSTEMS, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5045 (2013.01); G06F 17/5036 (2013.01);
Abstract

A system, method, and computer program product for extending device model parameter specification flexibility when using a subcircuit wrapper. Embodiments facilitate device modeling by allowing a modeling engineer to eliminate the explicit specification of a large set of wrapped device instance parameters as parameters to the subcircuit wrapper itself. A circuit designer may now use the subcircuit wrapper to specify an instance of the subcircuit without having to explicitly provide values for all such parameters. The simulator program's built-in device model calculates its default parameter values, which are often the result of complex expressions involving the other parameters, resulting in more accurate simulations. Subcircuit wrappers no longer need to be explicitly regenerated when a new version of the wrapped device model becomes available for the simulator (e.g., one that supports additional instance parameters that were not present on the earlier version when the subcircuit wrapper was created).


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