The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
May. 20, 2015
Applicant:
Hermes-epitek Corp., Taipei, TW;
Inventor:
Chien-Yao Hung, Hsin-Chu, TW;
Assignee:
HERMES-EPITEK CORP., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); G01R 31/00 (2006.01); G01R 31/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01);
Abstract
The invention relates to a printed circuit board structure, which comprises a first body, a second body and a sleeve. The sleeve is arranged between and connected with the first body and the second body so as to generate a differential height between the first body and the second body. Via the differential height are solved the problems of insufficient probe stiffness and poor wafer-sort quality, which is caused by decreasing the probe diameter to adapt to miniaturized chips.
Quick Actions:
Hung, Chien-Yao. (2016). Printed circuit board structure (U.S. Patent No. 9408293). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9408293
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile