The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Dec. 15, 2014
Applicant:
Tera Probe, Inc., Yokohama, Kanagawa, JP;
Inventors:
Shinji Wakisaka, Ome, JP;
Takeshi Wakabayashi, Sayama, JP;
Assignee:
AOI ELECTRONICS CO., LTD., Kagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/538 (2006.01); H01L 23/28 (2006.01); H01L 23/50 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 21/561 (2013.01); H01L 21/6835 (2013.01); H01L 23/28 (2013.01); H01L 23/50 (2013.01); H01L 23/5389 (2013.01); H01L 24/09 (2013.01); H01L 24/14 (2013.01); H01L 24/19 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 23/525 (2013.01); H01L 24/28 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/20 (2013.01); H01L 2224/274 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/48151 (2013.01); H01L 2224/48491 (2013.01); H01L 2224/49 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83856 (2013.01); H01L 2224/85399 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15173 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19043 (2013.01);
Abstract
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.