The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
May. 30, 2012
Applicant:
Norio Yamanishi, Nagano, JP;
Inventor:
Norio Yamanishi, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/49811 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85455 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06558 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01);
Abstract
A semiconductor package includes a plurality of connection pads, which are electrically connected to connection terminals of a mounted component that is mounted on the semiconductor package, and recognition marks. The recognition marks are formed respectively within the area of each of at least two of the connection pads. Each recognition mark has an area that is smaller than the area of the connection mark in which it is formed.
Yamanishi, Norio. (2016). Semiconductor package (U.S. Patent No. 9406620). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9406620
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile