The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Mar. 28, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Shyh-An Chi, Hsinchu, TW;

Mark Shane Peng, Hsinchu, TW;

Yun-Han Lee, Baoshan Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/481 (2013.01); H01L 23/50 (2013.01); H01L 24/73 (2013.01); H01L 25/18 (2013.01); H01L 23/49816 (2013.01); H01L 24/48 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73257 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/30107 (2013.01);
Abstract

An integrated circuit system comprises an interposer, a first integrated circuit, and at least one voltage regulator module. The first integrated circuit comprises first bond pads, and is electrically connected to the interposer at a first position of the interposer via the first bond pads. The first integrated circuit also comprises second bond pads. The first integrated circuit further comprises at least two circuit blocks. The at least two circuit blocks are configured to operate at different operating voltages. The at least one voltage regulator module is electrically connected to the first integrated circuit via the second bond pads, and the at least one voltage regulator module is configured to convert a received power supply voltage to the respective operating voltage of one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads.


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