The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Dec. 21, 2010
Applicants:

Dinh Dang, Essex Junction, VT (US);

Thai Doan, Burlington, VT (US);

George A. Dunbar, Iii, Essex Junction, VT (US);

Zhong-xiang He, Essex Junction, VT (US);

Russell T. Herrin, Essex Junction, VT (US);

Christopher V. Jahnes, Upper Saddle River, NJ (US);

Jeffrey C. Maling, Grand Isle, VT (US);

William J. Murphy, North Ferrisburgh, VT (US);

Anthony K. Stamper, Williston, VT (US);

John G. Twombly, Essex Junction, VT (US);

Eric J. White, Charlotte, VT (US);

Inventors:

Dinh Dang, Essex Junction, VT (US);

Thai Doan, Burlington, VT (US);

George A. Dunbar, III, Essex Junction, VT (US);

Zhong-Xiang He, Essex Junction, VT (US);

Russell T. Herrin, Essex Junction, VT (US);

Christopher V. Jahnes, Upper Saddle River, NJ (US);

Jeffrey C. Maling, Grand Isle, VT (US);

William J. Murphy, North Ferrisburgh, VT (US);

Anthony K. Stamper, Williston, VT (US);

John G. Twombly, Essex Junction, VT (US);

Eric J. White, Charlotte, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H01H 59/00 (2006.01); H01L 21/768 (2006.01); H01L 41/113 (2006.01); H01H 57/00 (2006.01); B81B 3/00 (2006.01); G06F 17/50 (2006.01); H01H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01H 59/0009 (2013.01); B81B 3/0021 (2013.01); B81B 3/0072 (2013.01); B81C 1/00476 (2013.01); B81C 1/00619 (2013.01); G06F 17/5068 (2013.01); G06F 17/5072 (2013.01); H01H 1/0036 (2013.01); H01H 57/00 (2013.01); H01L 41/1136 (2013.01); B81B 2201/01 (2013.01); B81B 2201/014 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/04 (2013.01); B81C 1/0015 (2013.01); B81C 1/00626 (2013.01); B81C 2201/017 (2013.01); B81C 2201/0109 (2013.01); B81C 2201/0167 (2013.01); H01H 2057/006 (2013.01); H01L 2924/0002 (2013.01); Y10S 438/937 (2013.01); Y10T 29/42 (2015.01); Y10T 29/435 (2015.01); Y10T 29/49002 (2015.01); Y10T 29/4913 (2015.01); Y10T 29/49105 (2015.01); Y10T 29/49121 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/5313 (2015.01);
Abstract

Planar cavity Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structure are provided. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity having a planar surface using a reverse damascene process.


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