The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Feb. 13, 2015
Applicant:

Elmos Semiconductor Ag, Dortmund, DE;

Inventor:

Arnd Ten Have, Dortnund, DE;

Assignee:

ELMOS Semiconductor AG, Dortmund, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01); B81B 3/00 (2006.01); H01L 29/49 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); B81B 3/007 (2013.01); B81B 3/0018 (2013.01); B81B 3/0021 (2013.01); B81B 3/0072 (2013.01); B81B 3/0081 (2013.01); B81C 1/00626 (2013.01); G01L 9/0047 (2013.01); H01L 29/4916 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81C 2201/019 (2013.01); H01L 29/84 (2013.01);
Abstract

The semiconductor component, in particular for use as a component that is sensitive to mechanical stresses in a micro-electromechanical semiconductor component, for example a pressure or acceleration sensor, is provided with a semiconductor substrate (), in the upper face of which an active region () made of a material of a first conductivity type is introduced by ion implantation. A semiconducting channel region having a defined length (L) and width (B) is designed within the active region (). In the active region (), each of the ends of the channel region located in the longitudinal extension is followed by a contacting region () made of a semiconductor material of a second conductivity type. The channel region is covered by an ion implantation masking material (), which comprises transverse edges defining the length (L) of the channel region and longitudinal edges defining the width (B) of the channel region and which comprises an edge recess () at each of the opposing transverse edges aligned with the longitudinal extension ends of the channel region, the contacting regions () that adjoin the channel region extending all the way into said edge recess.


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