The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Jul. 20, 2011
Applicants:

Kunihisa Kato, Tokyo, JP;

Tsuyoshi Muto, Tokyo, JP;

Kazue Uemura, Tokyo, JP;

Emi Nakajima, Tokyo, JP;

Inventors:

Kunihisa Kato, Tokyo, JP;

Tsuyoshi Muto, Tokyo, JP;

Kazue Uemura, Tokyo, JP;

Emi Nakajima, Tokyo, JP;

Assignee:

LINTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 51/44 (2006.01); H05K 1/02 (2006.01); C08J 7/04 (2006.01); C09J 7/02 (2006.01); C09J 9/02 (2006.01); C09J 11/08 (2006.01);
U.S. Cl.
CPC ...
H01L 51/442 (2013.01); C08J 7/045 (2013.01); C08J 7/047 (2013.01); C09J 7/021 (2013.01); C09J 9/02 (2013.01); C09J 11/08 (2013.01); H05K 1/0274 (2013.01); C08J 2323/06 (2013.01); C09J 2201/602 (2013.01); C09J 2203/322 (2013.01); C09J 2429/00 (2013.01); C09J 2433/00 (2013.01); C09J 2479/02 (2013.01); Y10T 156/10 (2015.01);
Abstract

The present invention provides a transparent conductive film which is low in terms of surface resistivity and high in terms of transparency. The transparent conductive film according to the present invention includes an adhesive conductive layer in openings of a conductive metal mesh layer provided on at least one surface of a transparent base material, wherein In addition, the present invention provides an electronic device having the foregoing transparent conductive film and a method for manufacturing an electronic device including forming a photoelectric conversion layer on an anodic layer and sticking the conductive layer of the transparent conductive film and a surface of the photoelectric conversion layer to each other at a temperature at which the foregoing conductive adhesive composition is softened or higher.


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