The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Mar. 12, 2015
Chipmos Technologies Inc., Hsinchu, TW;
Chi-Jin Shih, Hsinchu, TW;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A quad flat no-lead package includes an encapsulant, and a plurality of chip pads, a plurality of bond pads and a chip disposed in the encapsulant. Each chip pad is connected to at least one of the chip pads adjacent thereto by a first extending portion. The chip pads and the bond pads are arranged in an array. The chip pads are disposed at the center of the array and the bond pads are disposed around the chip pads. Each of the bond pads and at least one of the bond pads or one of the chip pads adjacent thereto each has a second extending portion formed therebetween and corresponding to each other. Every two of the second extending portions corresponding to each other are separated by a groove. The chip is mounted on a top surface of the chip pads and is electrically coupled to the bond pads.