The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

May. 08, 2015
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventor:

Ashok V. Kulkarni, San Jose, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2006.01); G06T 7/60 (2006.01); G06F 17/50 (2006.01); G01N 21/88 (2006.01); G01B 21/16 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01B 21/16 (2013.01); G01N 21/8851 (2013.01); G06F 17/5045 (2013.01); G06T 7/0044 (2013.01); G06T 7/60 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01); G01N 2201/10 (2013.01); G01N 2201/12 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.


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