The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Aug. 27, 2014
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventor:
Tomoharu Fujii, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01C 17/06 (2006.01); C25D 5/02 (2006.01); C25D 5/10 (2006.01); H01F 41/04 (2006.01); C25D 7/00 (2006.01); H01F 17/00 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
C25D 5/10 (2013.01); C25D 5/022 (2013.01); C25D 7/001 (2013.01); H01F 17/0006 (2013.01); H01F 41/046 (2013.01); C23C 18/1653 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0073 (2013.01);
Abstract
A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer.