The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Nov. 14, 2014
Intel Corporation, Santa Clara, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the present description relate to mechanisms for transferring heat through a microelectronic substrate from a photonic device to a heat dissipation device. In one embodiment, the microelectronic substrate may comprise a highly thermally conductive dielectric material. In another embodiment, the microelectronic substrate may comprise a conductive insert within the microelectronic substrate wherein the photonic device is in thermal contact with the conductive insert proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the conductive insert proximate an opposing surface of the microelectronic substrate. In still another embodiment, a stepped heat spreader, having a base portion and a pedestal portion, has the pedestal portion inserted through the microelectronic substrate, wherein the photonic device is in thermal contact with the pedestal portion proximate one surface of the microelectronic substrate and the heat dissipation device is thermal contact with the base portion.