The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Sep. 17, 2014
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 27/30 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 41/041 (2013.01); H01F 27/2804 (2013.01); H01F 27/323 (2013.01); H01F 41/04 (2013.01); H01F 41/042 (2013.01); H01F 41/043 (2013.01); H01F 41/045 (2013.01); H01F 2027/2809 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49069 (2015.01); Y10T 29/49071 (2015.01); Y10T 29/49073 (2015.01); Y10T 156/10 (2015.01);
Abstract
A method of manufacturing a coil substrate, includes forming a plurality of structures, each of the structures including a first insulating layer and a metal layer formed on the first insulating layer; forming a stacked structure by stacking the structures while connecting the metal layers of the adjacent structures in series; and shaping the stacked structure such that the metal layers of the structures are shaped at the same time to be in shapes of wirings, each becomes a part of a spiral-shaped coil, to form the spiral-shaped coil in which the wirings of the adjacent structures are connected in series.