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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9394619 B1

PDFFull Text
Date of Patent:
Jul. 19, 2016

Filed:

Mar. 12, 2013

Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rajen S. Sidhu, Chandler, AZ (US);

Mukul P. Renavikar, Chandler, AZ (US);

Sandeep B. Sane, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Winkle, PLLC

Primary Examiner:

Sherman Ng

Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); C25D 3/58 (2006.01); C25D 5/02 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); C23C 18/48 (2006.01);
U.S. Cl.
CPC ...
C25D 3/58 (2013.01); C25D 5/02 (2013.01); C23C 18/48 (2013.01); H05K 3/421 (2013.01); H05K 3/4644 (2013.01);
Abstract

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming an opening in a dielectric material of a package substrate, and then plating a conductive interconnect structure in the opening utilizing a plating process. The plating process may comprises a conductive metal and a dopant comprising between about 0.05 and 10 percent weight, wherein the dopant comprises at least one of magnesium, zirconium and zinc.

Find Patent Forward Citations

Sidhu, Rajen. (2016). Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby (U.S. Patent No. 9394619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9394619

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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