The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Mar. 12, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Rajen S. Sidhu, Chandler, AZ (US);
Mukul P. Renavikar, Chandler, AZ (US);
Sandeep B. Sane, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); C25D 3/58 (2006.01); C25D 5/02 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); C23C 18/48 (2006.01);
U.S. Cl.
CPC ...
C25D 3/58 (2013.01); C25D 5/02 (2013.01); C23C 18/48 (2013.01); H05K 3/421 (2013.01); H05K 3/4644 (2013.01);
Abstract
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming an opening in a dielectric material of a package substrate, and then plating a conductive interconnect structure in the opening utilizing a plating process. The plating process may comprises a conductive metal and a dopant comprising between about 0.05 and 10 percent weight, wherein the dopant comprises at least one of magnesium, zirconium and zinc.