The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Mar. 28, 2012
Applicants:

Kazuhiro Nobori, Handa, JP;

Masahito Eguchi, Chita-Gun, JP;

Takuji Kimura, Kariya, JP;

Inventors:

Kazuhiro Nobori, Handa, JP;

Masahito Eguchi, Chita-Gun, JP;

Takuji Kimura, Kariya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 39/00 (2006.01); C04B 35/645 (2006.01); B32B 18/00 (2006.01); C04B 35/111 (2006.01); C04B 35/581 (2006.01); C04B 35/626 (2006.01); C04B 35/634 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C04B 35/645 (2013.01); B32B 18/00 (2013.01); C04B 35/111 (2013.01); C04B 35/581 (2013.01); C04B 35/6264 (2013.01); C04B 35/63456 (2013.01); C04B 35/63488 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3222 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/445 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/6023 (2013.01); C04B 2235/661 (2013.01); C04B 2235/784 (2013.01); C04B 2235/785 (2013.01); C04B 2235/786 (2013.01); C04B 2235/80 (2013.01); C04B 2235/85 (2013.01); C04B 2235/9638 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); H01L 21/6833 (2013.01); Y10T 279/23 (2015.01);
Abstract

A method for producing an electrostatic chuck includes the steps of (a) placing a ceramic slurry in a molding die, the ceramic slurry containing a ceramic powder, a solvent, a dispersing agent, and a gelling agent, gelatinizing the ceramic slurry in the molding die, and removing the molding die to obtain first and second ceramic molded bodies; (b) drying, debinding, and calcining the first and second molded bodies to obtain first and second ceramic calcined bodies; (c) printing an electrostatic electrode paste on a surface of one of the first and second ceramic calcined bodies to form an electrostatic electrode while assuming the first ceramic calcined body is to form a dielectric layer of an electrostatic chuck; and (d) superposing the first and second ceramic calcined bodies on each other to sandwich the electrostatic electrode and subjecting the first and second calcined bodies to hot-press firing.


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