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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9392705 B1

PDFFull Text
Date of Patent:
Jul. 12, 2016

Filed:

Aug. 28, 2014

Wiring board with through wiring

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Masahiro Sunohara, Nagano, JP;

Yuichiro Shimizu, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Michael F McAllister

Int. Cl.
CPC ...
H05K 3/42 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 21/288 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/423 (2013.01); H01L 21/2885 (2013.01); H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 21/76847 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/1476 (2013.01); H05K 2203/1572 (2013.01);
Abstract

A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring formed in the through hole and including a first metal layer formed on a part of an inner side surface of the through hole at the one surface side, a first wiring layer that covers the first metal layer to fill a part of the through hole at the one surface side, a second metal layer continuously formed on the rest part of the inner side surface of the through hole at the other surface side and on an end portion of the first wiring layer at the other surface side, and a second wiring layer that covers the second metal layer to fill a part of the through hole at the other surface side.

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