The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Jun. 23, 2015
Applicant:

Sanken Electric Co., Ltd., Niiza-shi, Saitama, JP;

Inventors:

Hiroko Kawaguchi, Niiza, JP;

Hiromichi Kumakura, Niiza, JP;

Toru Yoshie, Niiza, JP;

Shuichi Okubo, Niiza, JP;

Assignee:

Sanken Electric Co., LTD., Niiza-shi, Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0312 (2006.01); H01L 29/06 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0619 (2013.01); H01L 29/872 (2013.01);
Abstract

A semiconductor device includes an n-type semiconductor substrate, which has a main surface having an element region and an outer peripheral region surrounding the element region; a p-type guard ring, which includes: a lowly-doped p-type region disposed on an upper surface of the semiconductor substrate in the outer peripheral region surrounding the element region; and a highly-doped p-type region disposed on an inner side of the lowly-doped p-type region and having an impurity concentration higher than an impurity concentration of the lowly-doped p-type region, wherein a side surface and a bottom surface of the highly-doped p-type region are covered by the lowly-doped p-type region such that the highly-doped p-type region is not in contact with the n-type region; and an ohmic junction electrode, which forms an ohmic junction with the highly-doped p-type region.


Find Patent Forward Citations

Loading…