The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Oct. 20, 2014
Applicant:
Broadcom Corporation, Irvine, CA (US);
Inventors:
Sam Ziqun Zhao, Irvine, CA (US);
Galen Kirkpatrick, Redondo Beach, CA (US);
Edward Law, Ladera Ranch, CA (US);
Reza Khan, Irvine, CA (US);
Ming Wang Sze, Irvine, CA (US);
Assignee:
Broadcom Corporation, Irvine, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3178 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 22/14 (2013.01); H01L 23/3135 (2013.01); H01L 23/544 (2013.01); H01L 24/14 (2013.01); H01L 24/46 (2013.01); H01L 24/96 (2013.01); H01L 24/95 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/95 (2013.01);
Abstract
A semiconductor package includes a semiconductor unit containing an active circuitry layer. The semiconductor package also includes a plurality of bonding pads on the active circuitry layer, which are configured to be connected to corresponding external conductive connectors. The semiconductor package also includes a protective sealant coating filling grooved edges of the active circuitry layer. The protective sealant coating contains an exterior wafer-singulated surface.