The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Mar. 14, 2012
Chien Rhone Wang, Hsin-Chu, TW;
Chih-wei Lai, Hsin-Chu, TW;
Chih-chiang Chang, New Taipei, TW;
Kewei Zuo, Yonghe, TW;
Jing-cheng Lin, Hsin-Chu, TW;
Chien Rhone Wang, Hsin-Chu, TW;
Chih-Wei Lai, Hsin-Chu, TW;
Chih-Chiang Chang, New Taipei, TW;
Kewei Zuo, Yonghe, TW;
Jing-Cheng Lin, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Packaging methods, material dispensing methods and apparatuses, and automatic measurement systems are disclosed. In one embodiment, a method of packaging semiconductor devices includes coupling a second die to a top surface of a first die, dispensing a first amount of underfill material between the first die and the second die, and capturing an image of the underfill material. Based on the image captured, a second amount or no additional amount of underfill material is dispensed between the first die and the second die.