The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Dec. 09, 2010
Applicants:
Kazuto Shimada, Shizuoka-ken, JP;
Kimi Ikeda, Shizuoka-ken, JP;
Yoshiharu Yabuki, Shizuoka-ken, JP;
Daisuke Arioka, Shizuoka-ken, JP;
Inventors:
Kazuto Shimada, Shizuoka-ken, JP;
Kimi Ikeda, Shizuoka-ken, JP;
Yoshiharu Yabuki, Shizuoka-ken, JP;
Daisuke Arioka, Shizuoka-ken, JP;
Assignee:
FUJIFILM Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/20 (2006.01); G03F 7/032 (2006.01); G03F 1/56 (2012.01); G03F 7/027 (2006.01); G03F 7/033 (2006.01); G03F 7/105 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G03F 7/032 (2013.01); G03F 1/56 (2013.01); G03F 7/027 (2013.01); G03F 7/033 (2013.01); G03F 7/105 (2013.01); H05K 3/3452 (2013.01);
Abstract
The present invention provides a polymerizable composition for a solder resist, including an infrared ray shielding material, a polymerization initiator, and a polymerizable compound, and a solder resist pattern forming method using the polymerizable composition for a solder resist.