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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9389504 B1

PDFFull Text
Date of Patent:
Jul. 12, 2016

Filed:

Feb. 20, 2013

Photo-curable and thermo-curable resin composition, and dry film solder resist

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Se-Jin Ku, Daejeon, KR;

Byung-Ju Choi, Daejeon, KR;

Woo-Jae Jeong, Daejeon, KR;

Bo-Yun Choi, Daejeon, KR;

Kwang Joo Lee, Daejeon, KR;

Min-Su Jeong, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Martin Angebranndt

Int. Cl.
CPC ...
G03F 7/029 (2006.01); G03F 7/032 (2006.01); C08F 2/50 (2006.01); C08F 2/46 (2006.01); C09D 179/04 (2006.01); C08G 73/06 (2006.01);
U.S. Cl.
CPC ...
G03F 7/029 (2013.01); C08G 73/065 (2013.01); C08G 73/0644 (2013.01); C08G 73/0655 (2013.01); C09D 179/04 (2013.01); G03F 7/032 (2013.01);
Abstract

The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator.

Find Patent Forward Citations

Quick Actions:

Ku, Se-Jin. (2016). Photo-curable and thermo-curable resin composition, and dry film solder resist (U.S. Patent No. 9389504). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9389504

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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