The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2016
Filed:
Jan. 19, 2014
Applicant:
Innovative Micro Technology, Goleta, CA (US);
Inventors:
Benedikt Zeyen, Santa Barbara, CA (US);
Jeffery F. Summers, Santa Barbara, CA (US);
Assignee:
Innovative Micro Technology, Goleta, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); B81B 1/00 (2006.01); B32B 37/00 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B81B 1/00 (2013.01); B32B 37/0084 (2013.01); B81C 1/00269 (2013.01); B32B 2037/1269 (2013.01); B81B 7/00 (2013.01); B81C 2203/019 (2013.01); Y10T 428/13 (2015.01); Y10T 428/24851 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/31536 (2015.04);
Abstract
A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.