The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Jul. 25, 2014
Applicant:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Jae-Ho Min, Yongin-Si, KR;
Ki-Jeong Kim, Hwaseong-Si, KR;
Kyoung-Sub Shin, Seongnam-Si, KR;
Dong-Hyun Kim, Hwaseong-Si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 27/115 (2006.01); H01L 27/02 (2006.01); H01L 21/033 (2006.01); H01L 21/3213 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11517 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/32139 (2013.01); H01L 27/0203 (2013.01); H01L 27/1157 (2013.01); H01L 27/11519 (2013.01); H01L 27/11524 (2013.01); H01L 27/11548 (2013.01); H01L 27/11565 (2013.01); H01L 27/11575 (2013.01); H01L 27/3276 (2013.01);
Abstract
In a semiconductor device, parallel first and second conductive lines having a unit width extend from a memory cell region into a connection region. A trim region in the connection region includes pads respectively connected to the first and second conductive lines but are separated by a width much greater than the unit width.