The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2016
Filed:
Jan. 10, 2013
Intel Deutschland Gmbh, Neubiberg, DE;
Thorsten Meyer, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Bernd Waidhas, Pettendorf, DE;
Hans-Joachim Barth, Munich, DE;
Sven Albers, Regensburg, DE;
Reinhard Golly, Ottobrunn, DE;
Philipp Riess, Munich, DE;
Bernd Ebersberger, Egmating, DE;
Intel Deutschland GmbH, Neubiberg, DE;
Abstract
A semiconductor device includes: a chip having at least one electrically conductive contact at a first side of the chip; an extension layer extending laterally from one or more sides of the chip; a redistribution layer on a surface of the extension layer and the first side, and coupled to the contact; an interposer having at least one electrically conductive contact at a first surface of the interposer and coupled to the redistribution layer, and at least one electrically conductive contact at a second surface of the interposer opposite to the first surface; a molding material at least partially enclosing the chip and the redistribution layer, and in contact with the interposer. Another semiconductor device includes: an interposer; a redistribution layer over the interposer; a circuit having first and second circuit portions, wherein the redistribution layer includes the first circuit portion, and the interposer includes the second circuit portion.